Custom Thermal Shock Test Chambers Meets JESD22-A106B Standards

1. Product Name and Purpose

2. Product Features

• Robust and High-Performance Chamber Construction
  • The chamber is constructed with heavy-duty, heat-resistant materials that can endure the intense thermal forces. The walls are fabricated from high-strength alloy steel, combined with advanced thermal insulation layers to minimize heat transfer between the hot and cold zones. The door is engineered with a precision sealing mechanism and a viewing window, allowing operators to closely monitor the testing process without compromising the chamber's integrity. The interior is designed with custom racks and fixtures, enabling the accommodation of a wide variety of component sizes and shapes and ensuring uniform exposure to the thermal shock conditions.
• Ultra-Precision Temperature Control and Cycling System
  • Temperature Range and Cycling: Capable of achieving a wide temperature range, typically from -80°C to +150°C. The system can execute rapid temperature cycling between the hot and cold zones, with a transition time as short as a few seconds. This is crucial for mimicking the abrupt temperature changes that electronic components may experience. The temperature control is accurate to within ±0.2°C, providing highly reliable and repeatable test results.
  • Programmable Temperature Profiles: The chamber's control system allows for the creation and execution of complex, custom temperature profiles. Operators can define specific temperature levels, dwell times in each zone, and the sequence and number of thermal shock cycles to replicate a diverse range of real-world manufacturing and operating conditions. This flexibility enables comprehensive testing of components under different mission-critical scenarios.
• Intuitive Control Panel and Data Acquisition Interface
  • The control panel is designed for ease of use by semiconductor and electronics engineers. It offers a user-friendly interface that allows effortless setting and adjustment of all test parameters, including temperature, cycling times, and component identification. The panel also provides real-time displays of the current temperature in both zones, the status of the testing process, and any alarms or warnings. The chamber is integrated with a comprehensive data acquisition system that records all relevant test data. This includes detailed temperature histories, cycle counts, and any observable changes in the electrical, physical, or performance characteristics of the tested components. The data can be stored in a secure, encrypted format in the chamber's built-in memory or exported to external storage devices for in-depth analysis and reporting. The system can also generate detailed test reports in various standardized formats.
• Enhanced Safety and Security Features
  • To ensure the safety of operators and the protection of sensitive test samples and the chamber itself, a suite of advanced safety and security features is incorporated. These include multiple layers of over-temperature and over-current protection, emergency stop buttons with redundant circuitry, and alarms for any abnormal temperature fluctuations, equipment malfunctions, or security breaches. The chamber is also equipped with access control mechanisms, such as biometric authentication or smart card readers, to prevent unauthorized access and safeguard classified testing activities. Additionally, it has a self-contained fire suppression system and proper ventilation and exhaust mechanisms to handle any potentially hazardous gases or vapors that may be generated during testing.

3. Specific Parameters

• Temperature Range and Accuracy
  • The -80°C to +150°C temperature range with ±0.2°C accuracy offers a comprehensive and precise testing envelope. Electronic components often have strict temperature tolerance requirements due to their complex internal structures and functions. For example, a transistor's electrical characteristics can change significantly with temperature, and accurate temperature control is essential for evaluating its stability. The wide temperature range allows for the assessment of components under both extremely cold and hot conditions, ensuring compliance with JESD22-A106B.
• Thermal Shock Cycle Parameters
  • The chamber can be programmed to perform a highly customizable number of thermal shock cycles, ranging from a few dozen to several thousand, depending on the specific requirements of the component and its expected service life. The dwell time in each temperature zone can be adjusted from milliseconds to hours, enabling the simulation of a vast array of manufacturing and operational scenarios. For instance, an integrated circuit used in a mobile device may need to withstand short, frequent thermal shock cycles during its use, while a component in a server may experience longer, less frequent cycles.